Technical parameters/power supply voltage (DC): 2.70V (min)
Technical parameters/number of pins: 24
Technical parameters/clock frequency: 104 MHz
Technical parameters/memory capacity: 4000000 B
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Each
Other/Manufacturing Applications: Consumer Electronics, Industrial, Communications&Networking, Industrial, Communication and Networking, Consumer Electronics, Computers and Computer Peripherals, Computers&Computer Peripherals
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL032P0XBHI020
|
Spansion | 功能相似 | BGA |
SPANSION S25FL032P0XBHI020 闪存, 或非, 32 Mbit, 104 MHz, SPI, BGA, 24 引脚
|
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