Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
JS28F640J3F75B
|
Micron | 功能相似 | TSOP-56 |
NOR Flash Parallel 3V/3.3V 64Mbit 8M/4M x 8Bit/16Bit 75ns 56Pin TSOP T/R
|
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