Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: DFP
External dimensions/packaging: DFP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Rail
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | DFP |
OP-AMP, 4000uV OFFSET-MAX, 15MHz BAND WIDTH, CDFP10, CERAMIC, SOIC-10
|
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