Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDTQS3VH245SO
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Integrated Device Technology | 功能相似 | SOIC |
快速切换产品2.5V / 3.3V 8位,高带宽总线开关 QUICKSWITCH PRODUCTS 2.5V / 3.3V 8-BIT HIGH BANDWIDTH BUS SWITCH
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