Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SSOP-16
External dimensions/packaging: SSOP-16
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG212CSE+
|
Maxim Integrated | 功能相似 | SOIC-16 |
MAXIM INTEGRATED PRODUCTS DG212CSE+ 模拟开关, CMOS, SPST - 常开, 4 放大器, 175 ohm, ± 4.5V 至 ± 18V, NSOIC, 16 引脚
|
||
DG508ADJ+
|
Maxim Integrated | 功能相似 | DIP-16 |
MAXIM INTEGRATED PRODUCTS DG508ADJ+ 芯片, 模拟多路复用器, 单路, 8:1, DIP-16
|
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