Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CDLL4454
|
Microsemi | 完全替代 | DO-213AA |
SEITCHING二极管 SEITCHING DIODE
|
||
JAN1N4454UR-1
|
Microsemi | 类似代替 | DO-213AA |
MINI- MELF -SMD硅Swithching二极管 MINI-MELF-SMD Silicon Swithching Diode
|
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