Technical parameters/dissipated power: 500 mW
Technical parameters/voltage regulation value: 6.2 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MELF
External dimensions/packaging: MELF
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CDLL4627
|
Microsemi | 功能相似 | DO-213AA-2 |
无铅封装用于表面安装 LEADLESS PACKAGE FOR SURFACE MOUNT
|
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