Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: B
External dimensions/packaging: B
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microchip | 功能相似 | DO-35-2 |
500mW的齐纳二极管 500mW ZENER DIODES
|
||
JANTXV1N6319
|
Microsemi | 功能相似 | DO-35 |
500mW的齐纳二极管 500mW ZENER DIODES
|
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