Technical parameters/dissipated power: 150000 mW
Technical parameters/breakdown voltage (collector emitter): 1200 V
Technical parameters/reverse recovery time: 40 ns
Technical parameters/rated power (Max): 150 W
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/dissipated power (Max): 150000 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-268-3
External dimensions/length: 16.05 mm
External dimensions/width: 14 mm
External dimensions/height: 5.1 mm
External dimensions/packaging: TO-268-3
Physical parameters/operating temperature: -55℃ ~ 150℃ (TJ)
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IXGT15N120BD1
|
IXYS Semiconductor | 完全替代 | TO-268-3 |
Trans IGBT Chip N-CH 1200V 30A 150000mW 3Pin(2+Tab) TO-268AA
|
||
IXGT20N120BD1
|
IXYS Semiconductor | 类似代替 | TO-268-3 |
Trans IGBT Chip N-CH 1200V 40A 190000mW 3Pin(2+Tab) TO-268
|
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