Chip AI consultant
Package parameters/number of pins: 96
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/EU RoHS: Compliant
Other/Pin Count: 96
Other/Supplier Package: TW-BGA
Other/Counting: Surface Mount
Other/Package Height: 1(Max)
Other/Package Length: 13
Other/Package Width: 9
Other/PCB changed: 96
Compliant with standards/RoHS standards: RoHS Compliant
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