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Model IS61LF102418A-6.5B3I
Description SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 6.5ns 165Pin TFBGA
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Brand: Integrated Silicon Solution
Packaging BGA
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Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(2335) Minimum order quantity(1)
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Technical parameters/digits: 18

Technical parameters/access time (Max): 6.5 ns

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: BGA

External dimensions/packaging: BGA

Other/Product Lifecycle: End of Life

Compliant with standards/RoHS standards: Non-Compliant

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