Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Active
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61QDB21M36A-250M3L
|
Integrated Silicon Solution | 功能相似 | FBGA-165 |
SRAM Chip Sync Dual 1.8V 36M-Bit 1M x 36 0.45ns 165Pin FBGA
|
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