Technical parameters/power supply voltage (DC): 1.80 V, 1.89 V (max)
Technical parameters/clock frequency: 250MHz (max)
Technical parameters/digits: 36
Technical parameters/memory capacity: 36000000 B
Technical parameters/access time (Max): 0.45 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.71V ~ 1.89V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA-165
External dimensions/packaging: FBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61QDB21M36-250M3
|
Integrated Silicon Solution | 完全替代 | BGA-165 |
静态随机存取存储器 36Mb 1Mbx36 QUAD Sync 静态随机存取存储器
|
||
IS61QDB21M36A-250M3L
|
Integrated Silicon Solution | 完全替代 | FBGA-165 |
SRAM Chip Sync Dual 1.8V 36M-Bit 1M x 36 0.45ns 165Pin FBGA
|
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