Technical parameters/power supply voltage (DC): 3.30 V, 3.47 V (max)
Technical parameters/clock frequency: 200MHz (max)
Technical parameters/digits: 36
Technical parameters/access time: 3.1 ns
Technical parameters/memory capacity: 18000000 B
Technical parameters/access time (Max): 3.1 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 3.135V ~ 3.465V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: TFBGA-165
External dimensions/packaging: TFBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61NLP51236-200B3LI
|
Integrated Silicon Solution | 类似代替 | BGA-165 |
SRAM Chip Sync Quad 3.3V 18M-Bit 512K x 36 3.1ns 165Pin BGA
|
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