Technical parameters/power supply current: 500 mA
Technical parameters/digits: 18
Technical parameters/access time: 0.45 ns
Technical parameters/access time (Max): 0.45 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.71V ~ 1.89V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA-165
External dimensions/packaging: FBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61DDB22M18-250M3
|
Integrated Silicon Solution | 功能相似 | LBGA-165 |
DDR SRAM, 2MX18, 0.35ns, CMOS, PBGA165, 15 X 17MM, 1MM PITCH, FBGA-165
|
||
IS61DDB22M18A-250B4LI
|
Integrated Silicon Solution | 功能相似 | LBGA-165 |
静态随机存取存储器 36Mb, 2M x 18 DDR-II Sync 静态随机存取存储器
|
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