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Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/EU RoHS: Not Compliant
Other/Pin Count: 165
Other/Standard Package Name: BGA
Other/Supplier Package: TFBGA
Other/Counting: Surface Mount
Other/Package Height: 0.79
Other/Package Length: 15
Other/Package Width: 13
Other/PCB changed: 165
Other/Lead Shape: Ball
Compliant with standards/RoHS standards: Non-Compliant
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