Chip AI consultant
Technical parameters/digits: 32
Package parameters/number of pins: 90
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/ECCN (US): EAR99
Other/Chip Density (bits): 256M
Other/Organization: 8Mx32
Other/Number of Internal Banks: 4
Other/Number of Words per Bank: 2M
Other/Number of Bits/Word (bits): 32
Other/Data Bus Width (bits): 32
Other/Address Bus Width (bits): 14
Other/Process Technology: CMOS
Other/Interface Types: LVTTL
Other/Minimum Operating Supply Voltage (V): 3
Other/Typical Operating Supply Voltage (V): 3.3
Other/Maximum Operating Supply Voltage (V): 3.6
Other/Number of I/O Lines (bits): 32
Other/Supplier Package: TFBGA
Other/Standard Package Name: BGA
Other/Pin Count: 90
Other/Counting: Surface Mount
Other/Package Height: 0.8(Max)
Other/Package Length: 13
Other/Package Width: 8
Other/PCB changed: 90
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review