Technical parameters/power supply voltage: 1.7V ~ 1.95V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFBGA-60
External dimensions/packaging: TFBGA-60
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Integrated Silicon Solution | 功能相似 | TFBGA-60 |
64m, 1.8V, Mobile Ddr, 4mx16, 166MHz, 60 Ball Bga (8mmx10mm) Rohs, It, t&r
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