Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFBGA-54
External dimensions/packaging: TFBGA-54
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Discontinued at Digi-Key
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS42SM16400M-75BLI-TR
|
Integrated Silicon Solution | 功能相似 | TFBGA-54 |
64m, 3.3V, Mobile Sdram, 4mx16, 133MHz, 54 Ball Bga (8mmx8mm) Rohs, It, t&r
|
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