Chip AI consultant
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/EU RoHS: Compliant
Other/ECCN (US): EAR99
Other/Part Status: Active
Other/HTS: 8541.21.00.95
Other/Automotive: No
Other/Pin Count: 4
Other/Standard Package Name: DIP
Other/Supplier Package: HVMDIP
Other/Military: No
Other/Counting: Through Hole
Other/Package Height: 3.37(Max)
Other/Package Length: 5(Max)
Other/Package Width: 6.29(Max)
Other/PCB changed: 4
Other/Lead Shape: Through Hole
Compliant with standards/RoHS standards: RoHS Compliant
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