Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TO-263-3
External dimensions/width: 9.65 mm
External dimensions/packaging: TO-263-3
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
FDD6N25TF
|
ON Semiconductor | 功能相似 | TO-252-3 |
MOSFET N-CH 250V 4.4A DPAK
|
||
IRF624S
|
VISHAY | 类似代替 | TO-263 |
MOSFET N-CH 250V 4.4A D2PAK
|
||
IRF624S
|
International Rectifier | 类似代替 |
MOSFET N-CH 250V 4.4A D2PAK
|
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