Technical parameters/power supply voltage: 2.5V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 25
Encapsulation parameters/Encapsulation: XFBGA-25
External dimensions/height: 0.27 mm
External dimensions/packaging: XFBGA-25
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Mobile phone, digital camera, portable video
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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