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Description Optocoupler, Phototransistor Output (Dual, Quad Channel) Optocoupler, Phototransistor Output (Dual, Quad Channel)
Product QR code
Packaging DIP-16
Delivery time
Packaging method Each
Standard packaging quantity 1
12.44  yuan 12.44yuan
5+:
$ 14.5560
50+:
$ 13.9339
200+:
$ 13.5856
500+:
$ 13.4985
1000+:
$ 13.4114
2500+:
$ 13.3119
5000+:
$ 13.2497
7500+:
$ 13.1875
Quantity
5+
50+
200+
500+
1000+
Price
$14.5560
$13.9339
$13.5856
$13.4985
$13.4114
Price $ 14.5560 $ 13.9339 $ 13.5856 $ 13.4985 $ 13.4114
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(9771) Minimum order quantity(5)
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Technical parameters/rated voltage (DC): 1.15 V

Technical parameters/rise/fall time: 2 µs

Technical parameters/output voltage: 70.0 V

Technical parameters/number of channels: 4

Technical parameters/forward voltage: 1.15 V

Technical parameters/input current: 10.0 mA

Technical parameters/dissipated power: 500 mW

Technical parameters/rise time: 2 µs

Technical parameters/isolation voltage: 5.3 kV

Technical parameters/forward current: 60 mA

Technical parameters/output voltage (Max): 70 V

Technical parameters/forward voltage (Max): 1.3 V

Technical parameters/forward current (Max): 60 mA

Technical parameters/descent time: 11 µs

Technical parameters/operating temperature (Max): 100 ℃

Technical parameters/operating temperature (Min): -55 ℃

Technical parameters/dissipated power (Max): 500 mW

Encapsulation parameters/installation method: Through Hole

Package parameters/number of pins: 16

Encapsulation parameters/Encapsulation: DIP-16

External dimensions/length: 20.07 mm

External dimensions/width: 6.81 mm

External dimensions/height: 3.81 mm

External dimensions/packaging: DIP-16

Physical parameters/operating temperature: -55℃ ~ 100℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Each

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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