Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
Integrated Device Technology | 功能相似 | BGA |
八路T1 / E1短程模拟前端 OCTAL T1/E1 SHORT HAUL ANALOG FRONT END
|
||
IDT82V2048SBB
|
Integrated Device Technology | 功能相似 | BGA |
八路T1 / E1短程线路接口,具备单端选件单元 OCTAL T1/E1 SHORT HAUL LINE INTERFACE UNIT WITH SINGLE ENDED OPTION
|
||
IDT82V2048SBBG
|
Integrated Device Technology | 功能相似 | BGA |
八路T1 / E1短程线路接口,具备单端选件单元 OCTAL T1/E1 SHORT HAUL LINE INTERFACE UNIT WITH SINGLE ENDED OPTION
|
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