Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 17.9 mm
External dimensions/width: 8.4 mm
External dimensions/height: 2.62 mm
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Renesas Electronics | 完全替代 | DIP-28 |
先进先出 256 X 9 CMOS PARALLEL FIF
|
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