Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Cypress Semiconductor | 功能相似 | TQFP |
9兆位( 256K ×36 / 512K ×18 )流水线SRAM与NoBL⑩架构 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL⑩ Architecture
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IDT71V65803S133PF
|
Integrated Device Technology | 功能相似 | LQFP-100 |
256K ×36 , 512K ×18的3.3V同步ZBT SRAM的 256K x 36, 512K x 18 3.3V Synchronous ZBT SRAMs
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