Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT71V3579S85PF
|
Integrated Device Technology | 功能相似 | LQFP-100 |
SRAM Chip Sync Single 3.3V 4.5M-Bit 256K x 18 8.5ns 100Pin TQFP SRAM Chip Sync Single 3.3V 4.5M-Bit 256K x 18 8.5ns ...
|
||
IDT71V3579YS85PF
|
Integrated Device Technology | 功能相似 | LQFP-100 |
IC SRAM 4.5Mbit 8.5NS 100TQFP
|
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