Encapsulation parameters/Encapsulation: TSOP1
External dimensions/packaging: TSOP1
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Silicon Solution | 功能相似 | TSOP1 |
Standard SRAM, 32KX8, 10ns, CMOS, PDSO28, 0.45INCH, LEAD FREE, PLASTIC, TSOP1-28
|
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