Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-32
External dimensions/packaging: SOIC-32
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT71V124SA10PH
|
Integrated Device Technology | 功能相似 | SOIC-32 |
3.3V CMOS静态RAM 1兆欧( 128K ×8位)中心电源和接地引脚 3.3V CMOS Static RAM 1 Meg (128K x 8-Bit) Center Power & Ground Pinout
|
||
IDT71V124SA10PH8
|
Integrated Device Technology | 功能相似 | TSOP-32 |
IC SRAM 1Mbit 10NS 32TSOP
|
||
IDT71V124SA10PHG
|
Integrated Device Technology | 功能相似 | SOIC-32 |
SRAM(静态随机存取存储器)
|
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