Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP-2
External dimensions/packaging: TSOP-2
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT71016S15PHI8
|
Integrated Device Technology | 功能相似 | TSOP-44 |
IC SRAM 1Mbit 15NS 44TSOP
|
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