Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/packaging: TSSOP-16
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2308-1HPGGI
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
3.3V零延迟时钟乘法器 3.3V ZERO DELAY CLOCK MULTIPLIER
|
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