Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFQFN-24
External dimensions/packaging: TFQFN-24
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ICM-30630
|
InvenSense | 功能相似 | TFQFN-24 |
IMU ACCEL/GYRO I2C/SPI 24LGA
|
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