Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Maxim Integrated | 功能相似 | TSSOP-16 |
四路LVDS线接收器与流通引脚排列和“在路径”故障保护 Quad LVDS Line Receiver with Flow-Through Pinout and “In-Path” Fail-Safe
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Maxim Integrated | 功能相似 | TSSOP |
LVDS 接口集成电路
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