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Description SAMTEC HTSW-105-14-T-S Board-To-Board Connector, 2.54mm, 5Contacts, Header, HTSW Series, Through Hole, 1Rows
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Brand: Samtec
Packaging
Delivery time
Packaging method Bag
Standard packaging quantity 1
2.84  yuan 2.84yuan
5+:
$ 3.8394
25+:
$ 3.5550
50+:
$ 3.3559
100+:
$ 3.2706
500+:
$ 3.2137
2500+:
$ 3.1426
5000+:
$ 3.1142
10000+:
$ 3.0715
Quantity
5+
25+
50+
100+
500+
Price
$3.8394
$3.5550
$3.3559
$3.2706
$3.2137
Price $ 3.8394 $ 3.5550 $ 3.3559 $ 3.2706 $ 3.2137
Start batch production 5+ 25+ 50+ 100+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(5839) Minimum order quantity(5)
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Technical parameters/number of contacts: 5

Technical parameters/polarity: Male

Technical parameters/Contact electroplating: Tin

Technical parameters/number of rows: 1

Technical parameters/rated current (Max): 6.3A/contact

Technical parameters/operating temperature (Max): 105 ℃

Technical parameters/operating temperature (Min): -55 ℃

Technical parameters/rated voltage (Max): 550 VAC

Encapsulation parameters/installation method: Through Hole

Packaging parameters/pin spacing: 2.54 mm

External dimensions/height: 10.67 mm

External dimensions/pin spacing: 2.54 mm

Physical parameters/shell color: Natural

Physical parameters/contact material: Phosphor Bronze

Physical parameters/operating temperature: -55℃ ~ 105℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Bag

Other/Manufacturing Applications: Industrial

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/REACH SVHC standards: No SVHC

Compliant with standard/REACH SVHC version: 2015/06/15

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
0022285054 0022285054 Molex 功能相似 -
2.54毫米( .100 )间距KK®头,分离式,立式, 5电路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度8.13毫米( 0.320 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 8.13mm (.320), with Kinked PC Tails
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