Technical parameters/polarity: Male
Encapsulation parameters/installation method: Solder
Encapsulation parameters/Encapsulation: -
External dimensions/packaging: -
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HTSW-102-23-G-S
|
Samtec | 完全替代 |
SAMTEC HTSW-102-23G-S Board-To-Board Connector, 2.54mm, 2Contacts, Header, HTSW Series, Through Hole, 1Rows
|
|||
HTSW-102-23-L-S
|
Samtec | 完全替代 |
SAMTEC HTSW-102-23-L-S Board-To-Board Connector, 2.54mm, 2Contacts, Header, HTSW Series, Through Hole, 1Rows
|
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