Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 完全替代 | SOP |
15KV ESD保护,+5V,RS-232收发器
|
||
HIN232ECBZ-T
|
Renesas Electronics | 完全替代 | SOIC-16 |
15KV ESD保护,+5V,RS-232收发器
|
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