Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SO
External dimensions/packaging: SO
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-9000
|
Broadcom | 功能相似 | DIP-8 |
数字隔离器 Digital Isolator (100MBd)
|
||
HCPL-9000
|
AVAGO Technologies | 功能相似 | DIP-8 |
数字隔离器 Digital Isolator (100MBd)
|
||
HCPL-9000-000E
|
Broadcom | 功能相似 | DIP-8 |
Digital Isolator Three State 1CH 110MBd 8Pin PDIP Tube
|
||
HCPL-9000-300E
|
Broadcom | 完全替代 | DIP-8 |
Digital Isolator Three State 1CH 110MBd 8Pin PDIP SMD Tube
|
||
HCPL-9000-300E
|
AVAGO Technologies | 完全替代 | SO |
Digital Isolator Three State 1CH 110MBd 8Pin PDIP SMD Tube
|
||
HCPL-9000-500
|
AVAGO Technologies | 功能相似 | DIP-8 |
Digital Isolator Three State 1CH 110MBd 8Pin PDIP SMD T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review