Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-T251#500
|
AVAGO Technologies | 功能相似 | DIP-8 |
Optocoupler Drive Push-Pull 1CH 30V 600V 8Pin PDIP SMD T/R
|
||
HCPL-T251-000E
|
Broadcom | 完全替代 | DIP-8 |
Optocoupler Drive Push-Pull 1CH 30V 600V 8Pin PDIP Tube
|
||
HCPL-T251-300E
|
AVAGO Technologies | 完全替代 | DIP-8 |
Optocoupler Drive Push-Pull 1CH 30V 600V 8Pin PDIP SMD Tube
|
||
HCPL-T251-500E
|
Broadcom | 完全替代 | DIP-8 |
Optocoupler Drive Push-Pull 1CH 30V 600V 8Pin PDIP SMD T/R
|
||
HCPL-T251-500E
|
AVAGO Technologies | 完全替代 | DIP-8 |
Optocoupler Drive Push-Pull 1CH 30V 600V 8Pin PDIP SMD T/R
|
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