Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-8767905KEA
|
Broadcom | 功能相似 | CDIP-16 |
高速光耦合器 Transistor Output Hermetically sealed
|
||
5962-8767905KEC
|
AVAGO Technologies | 功能相似 | DIP |
OPTOISO 1.5kV TRANS W/BASE 16DIP
|
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