Technical parameters/isolation voltage: 3750 Vrms
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-0631-500E
|
AVAGO Technologies | 功能相似 | SOIC-8 |
BROADCOM LIMITED HCPL-0631-500E 光电耦合器, 数字式, 3.75KV, SOIC-8
|
||
HCPL-063A
|
AVAGO Technologies | 类似代替 | SOIC-8 |
2Channel LOGIC OUTPUT OPTOCOUPLER, 10Mbps, 0.4INCH, SOP-8
|
||
HCPL-063N
|
AVAGO Technologies | 类似代替 | SOIC-8 |
BROADCOM LIMITED HCPL-063N 光电耦合器, SMD, 双路, 逻辑输出
|
||
HCPL-0661-500E
|
AVAGO Technologies | 类似代替 | SOIC-8 |
2Channel LOGIC OUTPUT OPTOCOUPLER, 10Mbps, ROHS COMPLIANT, SOIC-8
|
||
TLP2630(F)
|
Toshiba | 功能相似 | DIP-8 |
Toshiba ### 光耦合器,Toshiba
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review