Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCNW135#300
|
Agilent | 功能相似 |
Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 1MBps, WIDEBODY 400 MIL, DIP-8
|
|||
HCNW135#300
|
AVAGO Technologies | 功能相似 | DIP |
Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 1MBps, WIDEBODY 400 MIL, DIP-8
|
||
HCNW135#300
|
Broadcom | 功能相似 | SMD-8 |
Logic IC Output Optocoupler, 1-Element, 5000V Isolation, 1MBps, WIDEBODY 400 MIL, DIP-8
|
||
HCNW135-300E
|
AVAGO Technologies | 完全替代 | PDIP-8 |
OPTOISO 5kV TRANS W/BASE 8SMD
|
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