Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCNR200
|
AVAGO Technologies | 功能相似 | PDIP |
Optoelectronic Device, DIP-8
|
||
|
|
Agilent | 功能相似 |
Optoelectronic Device, DIP-8
|
|||
HCNR200
|
ChendaHang | 功能相似 | DIP |
Optoelectronic Device, DIP-8
|
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