Technical parameters/number of pins: 11
Encapsulation parameters/installation method: Panel, Solder Lug
Encapsulation parameters/Encapsulation: Relay Socket
External dimensions/length: 29.4 mm
External dimensions/width: 21.2 mm
External dimensions/height: 11.2 mm
External dimensions/packaging: Relay Socket
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review