Technical parameters/tolerances: ±2 %
Technical parameters/resistance: 1.2 kΩ
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SIP-8
External dimensions/packaging: SIP-8
Physical parameters/operating temperature: -55℃ ~ 125℃
Physical parameters/temperature coefficient: ±100 ppm/℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: -
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Bourns J.W. Miller | 功能相似 | N/R |
Res Thick Film NET 1.2KΩ 2% 1W ±100ppm/℃ ISOL Conformal Coated 8Pin SIP Pin Thru-Hole Bulk
|
||
CSC08A031K20GEK
|
Vishay Semiconductor | 完全替代 | SIP-8 |
Res Thick Film NET 1.2KΩ 2% 1W ±100ppm/℃ ISOL Conformal 8Pin SIP Pin Thru-Hole Bulk
|
||
|
|
VISHAY | 完全替代 | SIP-8 |
Res Thick Film NET 1.2KΩ 2% 1W ±100ppm/℃ ISOL Conformal 8Pin SIP Pin Thru-Hole Bulk
|
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