Technical parameters/digits: 28
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 176
Encapsulation parameters/Encapsulation: TFBGA-176
External dimensions/length: 15.0 mm
External dimensions/width: 6.00 mm
External dimensions/packaging: TFBGA-176
External dimensions/thickness: 1.20 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74SSTUB32868AZRHR
|
TI | 类似代替 | NFBGA-176 |
具有地址奇偶校验的 28 位至 56 位寄存缓冲器 176-NFBGA -40 to 85
|
||
IDT74SSTUBH32868ABKG8
|
Integrated Device Technology | 完全替代 | TFBGA-176 |
28位可配置寄存缓冲器支持DDR2 28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2
|
||
|
|
Integrated Device Technology | 完全替代 | TFBGA-176 |
IC REGIST BUFF 25Bit DDR2 176BGA
|
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