Encapsulation parameters/installation method: Panel, Flange
Package parameters/number of pins: 1
External dimensions/height: 1.74 mm
Physical parameters/contact material: Copper Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review