Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Rail
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-9059001MCA
|
E2V | 功能相似 | DIP |
Buffer/Driver 6CH Inverting Open Drain CMOS 14Pin CDIP
|
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