Technical parameters/RAM size: 1K x 8
Technical parameters/digits: 16
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/packaging: SOIC-28
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DSPIC33FJ16GP102-I/SO
|
Microchip | 完全替代 | SOIC-28 |
16位 DSC 带16 KB 闪存 采用28 引脚SOIC封装
|
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