Encapsulation parameters/Encapsulation: DIE
External dimensions/packaging: DIE
Other/Product Lifecycle: Active
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCF8564AU/5GB/1,01
|
NXP | 功能相似 | DIE |
Real Time Clock Serial Clock/Calendar/Alarm/Timer/Interrupt Die Wafer
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review