Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: BGA-165
External dimensions/packaging: BGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
GS8182Q36BGD-200I
|
GSI | 功能相似 | LBGA |
SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165Pin FBGA Tray
|
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